BS EN 60749-20-1-2009 半导体器件.机械和气候试验方法.第20-1部分:对潮湿和焊接热综合效应敏感元器件的操作,包装,标识和运输
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【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Part20-1:Handling,packing,labellingandshippingofsurface-mountdevicessensitivetothecombinedeffectofmoistureandsolderingheat
【原文标准名称】:半导体器件.机械和气候试验方法.第20-1部分:对潮湿和焊接热综合效应敏感元器件的操作,包装,标识和运输
【标准号】:BSEN60749-20-1-2009
【标准状态】:现行
【国别】:英国
【发布日期】:2009-07-31
【实施或试行日期】:2009-07-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:气候试验;元部件;电气工程;电子工程;电子设备及元件;热学;集成电路;加标签;机械测试;潮气;抗湿;包装件;包装试验;塑料;耐力;半导体器件;半导体;航运;表面安装设备;耐钎焊温度;表面安装;表面安装装置;测试;运输
【英文主题词】:Climatictests;Components;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Heat;Integratedcircuits;Labelling;Mechanicaltesting;Moisture;Moistureresistance;Packages;Packagingtests;Plastics;Resistance;Semiconductordevices;Semiconductors;Shipping;SMD;Solderingtemperatureresistance;Surfacemounting;Surfacemountingdevices;Testing;Transport
【摘要】:ThispartofIEC60749appliestoallnon-hermeticSMDpackageswhicharesubjectedtoreflowsolderprocessesandwhichareexposedtotheambientair.ThepurposeofthisdocumentistoprovideSMDmanufacturersanduserswithstandardizedmethodsforhandling,packing,shipping,anduseofmoisture/reflowsensitiveSMDswhichhavebeenclassifiedtothelevelsdefinedinIEC60749-20.Thesemethodsareprovidedtoavoiddamagefrommoistureabsorptionandexposuretosolderreflowtemperaturesthatcanresultinyieldandreliabilitydegradation.Byusingtheseprocedures,safeanddamage-freereflowcanbeachieved,withthedrypackingprocess,providingaminimumshelflifecapabilityinsealeddry-bagsfromthesealdate.Twotestconditions,methodAandmethodB,arespecifiedinthesolderingheattestofIEC60749-20.FormethodA,moisturesoakconditionsarespecifiedontheassumptionthatmoisturecontentinsidethemoisturebarrierbagislessthan30%RH.FormethodB,moisturesoakingconditionsarespecifiedontheassumptionthatmanufacturer’sexposuretime(MET)doesnotexceed24handthemoisturecontentinsidethemoisturebarrierbagislessthan10%RH.Inanactualhandlingenvironment,SMDstestedbymethodAarepermittedtoabsorbmoistureupto30%RH,andSMDstestedbymethodBarepermittedtoabsorbmoistureupto10%RH.ThisstandardspecifiesthehandlingconditionsforSMDssubjectedtotheabovetestconditions.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:38P.;A4
【正文语种】:英语
【原文标准名称】:半导体器件.机械和气候试验方法.第20-1部分:对潮湿和焊接热综合效应敏感元器件的操作,包装,标识和运输
【标准号】:BSEN60749-20-1-2009
【标准状态】:现行
【国别】:英国
【发布日期】:2009-07-31
【实施或试行日期】:2009-07-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:气候试验;元部件;电气工程;电子工程;电子设备及元件;热学;集成电路;加标签;机械测试;潮气;抗湿;包装件;包装试验;塑料;耐力;半导体器件;半导体;航运;表面安装设备;耐钎焊温度;表面安装;表面安装装置;测试;运输
【英文主题词】:Climatictests;Components;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Heat;Integratedcircuits;Labelling;Mechanicaltesting;Moisture;Moistureresistance;Packages;Packagingtests;Plastics;Resistance;Semiconductordevices;Semiconductors;Shipping;SMD;Solderingtemperatureresistance;Surfacemounting;Surfacemountingdevices;Testing;Transport
【摘要】:ThispartofIEC60749appliestoallnon-hermeticSMDpackageswhicharesubjectedtoreflowsolderprocessesandwhichareexposedtotheambientair.ThepurposeofthisdocumentistoprovideSMDmanufacturersanduserswithstandardizedmethodsforhandling,packing,shipping,anduseofmoisture/reflowsensitiveSMDswhichhavebeenclassifiedtothelevelsdefinedinIEC60749-20.Thesemethodsareprovidedtoavoiddamagefrommoistureabsorptionandexposuretosolderreflowtemperaturesthatcanresultinyieldandreliabilitydegradation.Byusingtheseprocedures,safeanddamage-freereflowcanbeachieved,withthedrypackingprocess,providingaminimumshelflifecapabilityinsealeddry-bagsfromthesealdate.Twotestconditions,methodAandmethodB,arespecifiedinthesolderingheattestofIEC60749-20.FormethodA,moisturesoakconditionsarespecifiedontheassumptionthatmoisturecontentinsidethemoisturebarrierbagislessthan30%RH.FormethodB,moisturesoakingconditionsarespecifiedontheassumptionthatmanufacturer’sexposuretime(MET)doesnotexceed24handthemoisturecontentinsidethemoisturebarrierbagislessthan10%RH.Inanactualhandlingenvironment,SMDstestedbymethodAarepermittedtoabsorbmoistureupto30%RH,andSMDstestedbymethodBarepermittedtoabsorbmoistureupto10%RH.ThisstandardspecifiesthehandlingconditionsforSMDssubjectedtotheabovetestconditions.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:38P.;A4
【正文语种】:英语
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